Properties
- Ready-to-use two-component epoxy-based duromer resin
- High degree of chemical resistance
- Thixotropic, stable, trowelable
- Good adhesion to dry to medium-damp mineral surfaces and dry, open-pored polymer foams
- Fast strength development
Applications
- Adhesive for mouldings of the Mycoflex Resyst system for bonding mouldings to joint flanks and for bonding moulding transversal joints
- Formulated for adhesive bonding applications involving high demands on chemical resistance and small gap dimensions
- REACH-assessed exposure scenarios: Water contact periodic, inhalation periodic, application exposure